Glossary entry (derived from question below)
Dutch term or phrase:
doormetalisering
English translation:
through(-hole) metallisation
Added to glossary by
Frits Ens
Aug 8, 2007 17:54
16 yrs ago
Dutch term
doormetalisering
Dutch to English
Tech/Engineering
Electronics / Elect Eng
pcb
De keurcriteria voor dubbelzijdige printen met doormetalisering zijn overeenkomstig het in de norm ANSI/IPC-A-600D gestelde.
Het gaat hier dus om de verbinding van de ene kant van de print naar de andere. Is er iemand die regelmatig een soldeerbout in de hand heeft en hier de Engelse kreet voor weet?
Het gaat hier dus om de verbinding van de ene kant van de print naar de andere. Is er iemand die regelmatig een soldeerbout in de hand heeft en hier de Engelse kreet voor weet?
Proposed translations
(English)
| 3 +2 | through-hole metallisation |
vixen
|
Change log
Aug 8, 2007 21:37: Antoinette Verburg changed "Language pair" from "English to Dutch" to "Dutch to English"
Proposed translations
+2
53 mins
Selected
through-hole metallisation
Through-hole metallisation/metalization (UK/US)
Through-Hole Metallisation: to bring the signals on the outer layers tothe central one, through-holes have to be designed in the circuit. Etching isextremley important to preserve good ohmic contacts. In fact early prototypeswere affected by interruptions of the power lines, because of a poor metallisa-tion of the holes. Metallisation is strongly dependent on the previuos etchingoperations to clean the surface of the hole and to let the copper adhere easier.Also, metallisation adds ED copper on the outer layers necessarily. Productionengineering has to provide an accurate control of the ED deposited not to exceedfew microns of thickness.
www.slac.stanford.edu/BFROOT/www/doc/public/babar_notes/BaB...
However, electroless copper has remained the standard through hole metalization process in the fabrication of high reliability multilayer printed wiring boards.
http://www.electrochemicals.com/tech1a.html
Through-Hole Metallisation: to bring the signals on the outer layers tothe central one, through-holes have to be designed in the circuit. Etching isextremley important to preserve good ohmic contacts. In fact early prototypeswere affected by interruptions of the power lines, because of a poor metallisa-tion of the holes. Metallisation is strongly dependent on the previuos etchingoperations to clean the surface of the hole and to let the copper adhere easier.Also, metallisation adds ED copper on the outer layers necessarily. Productionengineering has to provide an accurate control of the ED deposited not to exceedfew microns of thickness.
www.slac.stanford.edu/BFROOT/www/doc/public/babar_notes/BaB...
However, electroless copper has remained the standard through hole metalization process in the fabrication of high reliability multilayer printed wiring boards.
http://www.electrochemicals.com/tech1a.html
Note from asker:
| Ja, lijkt me goed! |
4 KudoZ points awarded for this answer.
Comment: "Bedankt voor de moeite"
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